Expect phase compositions, thermal properties by thermodynamics calculation. Produce solders and analysis the microstructure and phase...

3D electronic packaging development Investigation of low temperature hybrid bonding Au passivation layer Fine grain Cu bonding Analysis the microstructure and phase composition by SEM, EDS and TEM Void morphology evolution  ▲ Thermal compression bonding by heating press Analyzing the voids along the Cu-to-Cu bonding interface and confirm the effects of temperature and pressure Investigation of low temperature hybrid bonding : Fine grain Cu bonding ▲ Analysis of grain orienta

Low temperature solution process has many advantages ; No need vacuum, cost efficiency, mass production, can use flexible substrate....

Due to resistivity and reliability issues, conventional Cu interconnect faces problems. Intermetallic compounds have been studied as...