Cu to Cu bonding

3D electronic packaging development Investigation of low temperature hybrid bonding Au passivation layer Fine grain Cu bonding Analysis the microstructure and phase composition by SEM, EDS and TEM

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Void morphology evolution

 ▲ Thermal compression bonding by heating press

• Analyzing the voids along the Cu-to-Cu bonding interface and confirm the effects of temperature and pressure

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Investigation of low temperature hybrid bonding : Fine grain Cu bonding

▲ Analysis of grain orientation by EBSD

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Investigation of low temperature hybrid bonding : Au passivation layer bonding

• We performed the Au passivation layer bonding for low temperature process, and investigate the bonding mechanism.

• Analysis of interface change by TEM

• Conducting patterned Cu-to-Cu bonding, and studying the bonding mechanism.