3D electronic packaging development Thermal compression Cu to Cu bonding by using Cu-Sn reaction Solid - State Diffusion (SSD) bonding below melting point of Sn(231.9℃) Analysis the microstructure and phase composition by SEM, EDS and TEM
Cu-Sn phase diagram
Thin Sn layer is deposited by e- beam evaporator
Cu to Cu bonding by using Sn-Sn reaction
Bonding Process
▲ Thermal compression bonding by heating press
Analysis by TEM
▲ Analysis the microstructure and phase composition by SEM, EDS and TEM