박모세 Mose Park
M.S./Ph.D. candidate, Smart Fab. Technology; Sungkyunkwan University
B.S. 2019, Physics; Sungkyunkwan University
Research: Nanowire networking by solution process
E-mail: pms7879@skku.edu
최훈 Choi Hoon
M.S./Ph.D. candidate, Smart Fab. Technology; Sungkyunkwan University
B.S. 2019, Advanced Materials Science and Engineering; Sungkyunkwan University
Research: Semiconductor Advanced Packaging
E-mail: akyd12@naver.com
이현동 Hyun-Dong Lee
M.S./Ph.D. candidate, Smart Fab. Technology; Sungkyunkwan University
B.S. 2022, Chemical Engineering; Ajou University
Research: Semiconductor Advanced Packaging
E-mail: hac5229@naver.com
Yanjin Tang
M.S./Ph.D. candidate, Smart Fab. Technology; Sungkyunkwan University
B.S. 2013, Biochemistry, Synthesis and Application of Nanomaterials; University of Electronic Science and Technology
Research: Synthesis and application of inorganic functional materials
E-mail: yanjintang@skku.edu
빈하형 Ha-Hyung Pin
M.S. candidate, Smart Fab. Technology; Sungkyunkwan University
B.S. 2022, Materials Science and Engineering; Ajou University
Research : Semiconductor Advanced Packaging
E-mail: phh7109@skku.edu
나승준 Seung-Jun Na
M.S. candidate, Smart Fab. Technology; Sungkyunkwan University
B.S. 2023, Mechanical Design Engineering; Tech University of Korea
Research: BEOL interconnect
E-mail: nasjoon@naver.com
김도현 Do-Hyun Kim
M.S candidate, Material Science & Engineering; Sungkyunkwan University, Samsung Institute of Technology
B.S. 2009, Materials Science and Engineering, Incheon National University
Research : Low Temperature Solder Solutions for Memory Package Products; Bi(or In) Composition Study
E-mail: crom.kim@samsung.com
손준희 Jun-Hee Son
M.S candidate, Material Science & Engineering; Sungkyunkwan University
B.S. 2023, Department of Chemistry; Ajou University
Research : Semiconductor Advanced Packaging
E-mail: junhee.son@g.skku.edu
한상은 Sang-Eun Han
M.S candidate, Material Science & Engineering; Sungkyunkwan University
B.S. 2023, Department of Energy and Resources Engineering; Kangwon National University
Research : Semiconductor Advanced Packaging
E-mail: sangeun35@kitech.re.kr
이다연 Da-Yeon Lee
-
Undergraduated, Materials Science and Engineering; Sungkyunkwan University
-
-
임정민 Jung-Min Lim
-
Undergraduated, Materials Science and Engineering; Sungkyunkwan University
-
-