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Join date: Aug 11, 2021
Posts (4)

Jul 23, 2021 ∙ 1 min
Low melting point solder development
Expect phase compositions, thermal properties by thermodynamics calculation. Produce solders and analysis the microstructure and phase...
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Jul 23, 2021 ∙ 1 min
Cu to Cu bonding
3D electronic packaging development Thermal compression Cu to Cu bonding by using Cu-Sn reaction Solid - State Diffusion (SSD) bonding...
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Jun 9, 2021 ∙ 1 min
Metal oxide / Chalcogenide Nano material synthesis& TFT device fabrication by Solution process...
Low temperature solution process has many advantages ; No need vacuum, cost efficiency, mass production, can use flexible substrate....
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