Cu to Cu bonding through Cu-Sn reaction



3D electronic packaging development Thermal compression Cu to Cu bonding by using Cu-Sn reaction Solid - State Diffusion (SSD) bonding below melting point of Sn(231.9℃) Analysis the microstructure and phase composition by SEM, EDS and TEM

 


Cu-Sn phase diagram

  • Thin Sn layer is deposited by e- beam evaporator

  • Cu to Cu bonding by using Sn-Sn reaction











 

Bonding Process




▲ Thermal compression bonding by heating press


 


Analysis by TEM



▲ Analysis the microstructure and phase composition by SEM, EDS and TEM